Publications

Journal Publications

Y. Park, K.S. Han, J.S. Woo, S.K. Chang, N. Rajmohan, J.A. Szpunar, Influence of Primary Annealing Condition on Texture Development in Grain Oriented Electrical Steels, Acta Materialia, 50 (2002) 1825-1834.
A.P. Zhilyaev, B.K. Kim, G.V. Nurislamova, M.D. Baro, J.A. Szpunar, T.G. Langdon, Orientation Imaging Microscopy of Ultrafine-Grained Nickel, Scripta Materialia, 46 (2002) 575-580.
A.P. Zhilyaev, G.P. Nurislamova, B.K. Kim, M.D. Baro, J.A. Szpunar, T.G. Langdon, Principles of Grain Refinement and Microstructural Evolution during High-Pressure Torsoin, Acta Materialia, pp 1825-1834.
H. Li, J.T. Park, J.A. Szpunar, A Model of Recrystallization Process in Motor Lamination Silicon Steel, Materials Science Forum, 408-412 (2002) 335-340.
S.J. Park, S.H. Choi, K.H. Oh, J.A. Szpunar, Prediction of Deformation and Texture Evolution in the Vicinity of a Hard Particle in an FCC Crystal, Materials Science Forum, 408-412 (2002) 377-382.
J.A. Szpunar, Annealing Texture, Do We Understand It?, Materials Science Forum, 408-412 (2002) 749-754.
J.Y. Park, J.A. Szpunar, Influence of the Primary Recrystallization Texture on Abnormal Grain Growth of Goss Grains in Grain Oriented Electrical Steels, Materials Science Forum, 408-412 (2002) 821-826.
J.Y. Park, J.T. Choi, T. Kang, K.H. Oh, J.A. Szpunar, A Microstructure and Texture Analysis in Twin-Roll Strip Cast Fe-36wt%Ni Alloy, Materials Science Forum, 408-412 (2002) 827-832.
B.K. Kim, J.A. Szpunar, R. Varano, Texture Evolution in Grain Growth of Nanocrystalline Ni, Materials Science Forum, 408-412 (2002) 937-942.
B.K. Kim, J.A. Szpunar, A. P. Zhilyaev, Annealing Texture in Thermal Stability of Ultrafine-Grained Ni, Materials Science Forum, 408-412 (2002) 943-948.
J. Lin, X. Cao, J.A. Szpunar, The Influence of the Texture and Microstructure of a Zr-2.5Nb Substrate Upon the Oxidation Kinetics, Materials Science Forum, 408-412 (2002) 1013-1018.
K.T. Lee, H.T. Jeong, J.A. Szpunar, H.G. Kim, The Influence of Substrate Texture on the Oxidation Kinetics of Copper, Materials Science Forum, 408-412 (2002) 937-942.
Y. Cao, H. Li, J.A. Szpunar, W.T. Shmayda, Effects of Texture on Hydrogen Diffusion in Nickel, Materials Science Forum, 408-412 (2002) 1139-1144.
J.T. Park, J.A. Szpunar, K. Han, A Effect of Initial Grain Size Prior to Cold Rolling on Annealing Texture in Non-Oriented Electrical Steel, Materials Science Forum, 408-412 (2002) 1257-1262.
J.T. Park, J.A. Szpunar, S. Cha, Effect of Temper Rolling Reduction and Annealing Time on Texture Formation during Final Annealing in Electrical Steels, Materials Science Forum, 408-412 (2002) 1263-1268.
M.R. Bateni, F. Ashrafizadeh, J.A. Szpunar, R.A.L. Drew, Improving the Tribological Behavior of Copper Through Novel Ti-Cu Intermetallic Coatings, Wear, 253 (2002) 626-639.
J.Y. Cho, J.A. Szpunar, The Effect of Grain Boundary Character Distribution (GBCD) on Edge Cracking during Hot Rolling of Austenitic Stainless Steel, Materials Science Forum, 408-412 (2002) 1365-1370.
B.K. Kim, J.A. Szpunar, B. Alexandre, Y. Takayama, Microstructure and Texture Evolution during Superplastic Deformation of 7475 Al Alloy, Materials Science Forum, 408-412 (2002) 1513-1518.
J.Y. Cho, J.A. Szpunar, The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits, Materials Science Forum, 408-412 (2002) 1609-1614.
K. Mirpuri, J.A. Szpunar, K. Kozaczek, Texture Investigation in Damascene Copper Interconnects, Materials Science Forum, 408-412 (2002) 1627-1632.
B.K. Kim, J.A. Szpunar, Anisotropic Microstructure of Iron Oxides Formed during High Temperature Oxidation of Steel, Materials Science Forum, 408-412 (2002) 1711-1716.
K. Mirpuri, J.A. Szpunar, K. Kozaczek, Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects, Materials Research Society, 721 (2002) 137.

Conference Publication

J.A. Szpunar, Bae-Kyun Kim and B. Alexandre, Microstructure and Texture Evolution in Superplastic Deformation of 7475 Al Alloy, The Conference for Technology Transfer, Partnership for the development of the aluminum industry, McGill University, Sept. 5-6, 2002, Montreal, Canada. S. Godet, P.J. Jacques, J.A. Szpunar, J.J. Jonas, and B-K. Kim, Microstructural Characterization of Variant Selection by EBSD in a Bainitic Steel Containing Retained Austenite, presented in the 10th International Conference on Martensitic Transformations, June 10-14, 2002, Helsinki University of Technology, Otaniemi, ESPOO, Finland.
J. Dutkiewicz, J.A. Szpunar, Baekyun Kim, Rachid Nciri, P. Malczewski and J. Kusnierz, Microstructure and Orientation Changes during Superplastic Deformation of Alpha+Beta CuZnSi Brasses, The Proceeding of the Fourth International Conference on Advanced Materials and Processing, ed. S. Hanada, Japan Institute of Metals, Hawaii, USA, Dec. 11-15, (2001) pp. 2085-2088.
J.A. Szpunar, Texture in Films, Invited Lecture, Meeting of the Japanese Texture Society, July 10-11 2002, Yokohama University of Technology, Yokohama, pp. 25-26.
M. R. Batani, F. Asrafizadeh, J.A. Szpunar and R.Drew, Increasing Wear Resistance of Copper Through Intermetallic Coatings, Mediterraneantrib'2002, Kayseri, Turkey, pp.28-35.
K. Mirpuri, J.A. Szpunar and K. Kozaczek, Influence of Line-Width on Microstructure and Texture of Damascene Copper Interconnects, Materials Research Society, Vol. 721 (2002), pp. 137.
Sheikh-Ali, A. D., J.A. Szpunar, Garmestani, H., Grain Boundary Sliding during Creep: Role of Boundary Misorientation and Strain Compatibility, Creep Deformation: Fundamentals and Applications, Proceedings 2002 TMS Annual Meeting, Seattle, WA, USA, (2002) 127-136.
P. Zhilyaev, G. V. Nurislamova, Bae-kyun Kim, M. D. Baro, J.A. Szpunar and T. G. Langdon, Grain Refinement and Microstructural Evolution in Nickel during High-Pressure Torsion, The 2nd Int. Conf. On Nanomaterials by Severe Plastic Deformation -Fundamentals/Processing/Applications, Dec 9-13, (2002) Materials Physics Institute University of Vienna, Austria.