M.R. Batani, J.A. Szpunar, The effect of Novel Ti Cu Intermetallic Compound Coatings on Friction and Wear Resistance of Copper, National Conference on Tribology, Galai ,ROMANIA, Sep. 2003. |
M.R. Batani, J.A. Szpunar, The Effect of Novel Ti Cu Intermetallic Compound Coatings on Friction and Wear Resistance of Copper, Tribological Journal Letters, 2003.
| H. Li, J. Lin, and J.A. Szpunar, Computer Modeling of Zirconium Oxide Formation and its Corrosion Resistance, NACE Northern Area Eastern Conference 2003, Ottawa
| H. Li, J. Lin and J.A. Szpunar, A Role of Texture in Controlling Oxidation and Hydrogen Ingress in Zr-Nb Pressure Tubes, Eighth International Conference on CANDU Fuel, 2003
| C. Nam and J.A. Szpunar, Failure Prediction of Irradiated Fuel Rod in Nuclear Reactors under Reactivity-Initiated Accidents by Means of Statistical Approach, Eighth International Conference on CANDU Fuel, 2003
| S. Wen, S. Omanovic and J.A. Szpunar, The Nucleation and Growth Mechanism in Tin Electrodeposition, TMS Spring 2004 Conference.
| K. Mirpuri, J. A. Szpunar and K. Kozaczek, Texture Analysis in as-Deposited and Annealed Damascene Cu Interconnects Using XRD & OIM, Metrology-ULSI Conference U of Texas,(2003)
| K. Mirpuri, J.A. Szpunar and K. Kozaczek, Texture and Residual Stress Analysis in As-deposited and Annealed Damascene Cu Interconnect Lines, Metrology-ULSI Conference U of Texas,(2003)
| K. Mirpuri, J.A. Szpunar and K. Kozaczek, Microstructure Analysis in As-deposited and Annealed Damascene Cu Interconnect Lines, Metrology-ULSI Conference U of Texas,(2003)
| Kabir Mirpuri, J. A. Szpunar and Kris Kozaczek, Residual Stress and Texture correlation as A Function of Linewidth in As-deposited and Annealed Damascene Cu Interconnects, IITC/IEEE/2003/San Francisco (2003)
| Jae-Young Cho, Hyo-Tae Jeong and J. A. Szpunar, The Effect of Texture and Grain Boundary Character Distribution (GBCD) on Edge Cracking During Planetary Hot Rolling of Austenitic Stainless Steel.
| P. Zhilyaev, G. V. Nurislamova, Bae-Kyun Kim, M. D. Baro, J. A. Szpunar and T. G. Langdon) Grain Refinement and Microstructural Evolution in Nickel During High-Pressure Torsion, The 2rd Int. Conf. On nanomaterials by Severe Plastic Deformation -Fundamentals/processing/Applications, Dec. 9-13, 2002, Materials Physics Institute, Universtiy of Vienna, Austria.
| Kabir Mirpuri, J. A. Szpunar and Kris Kozaczek, Microstructure Analysis in as-Deposited and Annealed Damascene Cu Interconnects Using Orientation Imaging Microscopy, IITC/IEEE/2003/San Francisco.
| V. N. Danilenko, B. K. Kim, J. A. Szpunar, A. P. Zhilyaev) TEM and OIM study of grain boundaries in recrystallized nichrome, Tentative programme of the International workshop, Interfaces in Advanced Materials IAM-03, Chernogolovka, Moscow district, Russia, 26-30 May, 2003.
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